hxfs circuit board disassembly machine equipment operation flow chart:

PCB Dismantling Process
The Haoxing PCB dismantling machine is designed to remove electronic components and solder from waste printed circuit boards. It uses controlled heating, drum rotation and screening to separate electronic components, solder particles and bare PCB boards for further recycling.
Automatic Feeding and Drum Heating
Waste circuit boards are fed into a perforated stainless steel rotating drum by a conveyor or feeding device. The electric heating system raises the drum temperature to the required operating range, helping soften or melt the solder that holds electronic components on the board surface. The temperature can be adjusted according to the PCB type, component density and processing requirements.
Drum Rotation and Component Separation
During operation, the drum rotates at a controlled speed. The circuit boards tumble and rub against each other inside the heated drum. Under the combined action of heat, gravity and mechanical friction, electronic components and solder gradually detach from the PCB substrate.
Screening and Collection
The separated solder particles and electronic components enter the screening section. Different screen openings can be used to classify fine solder particles and larger electronic components. The separated materials are discharged through different outlets for collection and further processing.
Bare PCB Discharge
After component removal, the bare PCB boards are discharged from the end of the drum. Depending on the recycling process, the bare boards can be sent to a PCB crusher, pulverizer, electrostatic separator or other downstream equipment for copper and non-metallic material separation.
Fume and Dust Treatment
During thermal dismantling, fume extraction and dust collection equipment can be configured according to the material condition and site requirements. The exhaust treatment system can include a spray tower, activated carbon adsorption unit or other treatment equipment according to the project configuration.